TCS launches Chiplet-based System Engineering Services to drive semiconductor innovation

THEBUSINESSBYTES BUREAU

MUMBAI, SEPTEMBER 11, 2025

Tata Consultancy Services (TCS), a global leader in IT services, consulting, and business solutions, has unveiled its Chiplet-based System Engineering Services to help semiconductor companies design faster, more efficient, and powerful next-generation processors.

Chiplets — small integrated circuits that act as modular building blocks of larger chips — are redefining how processors are designed. By leveraging this approach, TCS aims to accelerate innovation for global chipmakers at a time when demand for advanced semiconductors is at an all-time high.

India’s semiconductor market, valued at $45–50 billion in 2024–25, is projected to more than double to $100–110 billion by 2030. Supported by the ₹76,000 crore India Semiconductor Mission, the country is emerging as a global hub for chip design and manufacturing. Already home to 20% of the world’s chip design engineers, India is attracting significant investments in fabrication and assembly. TCS’ latest offering is expected to further strengthen this momentum by giving both Indian and global firms access to world-class chip-to-system engineering expertise.

The industry is at a critical inflection point. Traditional scaling methods — shrinking transistors to fit more onto a single chip—are no longer sufficient. Chiplet-based design enables multiple smaller chips to be combined flexibly, helping companies overcome performance bottlenecks, reduce costs, and bring products to market faster. This shift is particularly vital as AI, cloud computing, smartphones, electric vehicles, and connected devices fuel unprecedented demand for semiconductors.

“Semiconductors are the foundational technology driving digital innovation and powering differentiated experiences,” said V Rajanna, President, Technology, Software and Services, TCS. “Our Chiplet-based System Engineering Services will help semiconductor enterprises accelerate chiplet tape-outs, enhance scalability, and achieve faster time to market. With deep industry knowledge, extensive investments in next-gen technologies, and a proven track record, TCS is uniquely positioned to drive innovation at scale.”

In a recent engagement, TCS collaborated with a leading North American semiconductor firm to streamline heterogeneous device integration by adopting chiplet-based design. This modernization accelerated the company’s development of cutting-edge AI processors, enabling faster market entry.

TCS’ capabilities span design and verification of UCIe (Universal Chiplet Interconnect Express™) and HBM (High Bandwidth Memory) — key industry standards — along with advanced package design, including 2.5D and 3D interposers and multi-layer organic substrates. These services empower semiconductor clients to deliver next-generation multi-chip products with superior signal integrity, lower latency, and compact form factors.

Backed by over two decades of semiconductor expertise and a robust partner ecosystem, TCS offers a comprehensive chip-to-system engineering portfolio. The addition of Chiplet-based System Engineering Services reinforces its vision of democratizing advanced chip design for customers worldwide.

For nearly six decades, TCS has played a pivotal role in India’s technology transformation, partnering with government ministries to deliver large-scale citizen services and digital public infrastructure. From enabling stock exchanges and financial institutions to supporting passport services, health insurance, and pensions for defence personnel, TCS continues to impact millions of lives daily, with nearly 7 in 10 Indians benefiting from its solutions.