The Business Bytes
TBB BUREAU
ROURKELA, AUG 29, 2023
In a significant step towards technological advancement and innovation, Rourkela Steel Plant (RSP) has signed a Memorandum of Understanding (MoU) with the prestigious Indian Institute of Technology, Delhi (IITD). The collaboration aims to unlock the vast potential of 5G technology for industrial applications, heralding a new era of efficiency and productivity.
The MoU was signed by RSP ED (Works) SR Suryawanshi, and IITD Dean-Corporate Relations Professor Preeti Ranjan Panda in a ceremony organised on August 26 in IITD.
Expressing happiness over the inking of the MoU, Suryawanshi said that the collaboration is a resolute step towards unlocking the unprecedented capabilities of 5G technology. “The amalgamation of RSP’s industrial acumen with IIT Delhi’s research prowess holds great promise, not only for our operations but for catalyzing positive changes throughout the steel sector,” he added.
Panda in his address thanked RSP for the path-breaking collaboration that bridges the realms of industry and academia. He further said that the collaboration would help converge theoretical insights and practical applications, thus epitomizing the true essence of technological progress.
IIT Delhi has a long standing legacy of academic excellence and research prowess. Its expertise in engineering, technology and innovation is widely acknowledged. On the other hand, RSP, a cornerstone in the nation’s industrial map, brings decades of experience and intricate understanding of the challenges and opportunities that lie within the steel sector. The two entities can drive forward the envelope of knowledge and application in the crucial technological domain. Through joint research, development and implementation the organisations aim to unleash the full potential of 5G in enhancing operational efficiency, resource optimisation and sustainable practices.
The collaboration represents a significant stride towards establishing an ‘Atmanirbhar Bharat’ (self-reliant India), holding the pledge to usher in a fresh era of innovation and advancement.
