THEBUSINESSBYTES
BUREAU
BHUBANESWAR,
APRIL 19, 2026
Odisha
is poised to power Prime Minister Narendra Modi’s vision of making India
self-reliant in semiconductor and electronics manufacturing, Chief Minister
Mohan Charan Majhi said on Sunday, as the foundation stone for the country’s
first advanced 3D chip packaging unit was laid at Info Valley in Khordha
district.
In
a defining moment for India’s semiconductor ambitions, the Heterogeneous
Integration Packaging Solutions project — promoted by 3D Glass Solutions — marks
a significant leap in strengthening the domestic semiconductor ecosystem and
advancing the vision of Atmanirbhar Bharat in high-end electronics
manufacturing.
The
foundation stone was laid in the presence of Union Minister for Railways,
Electronics & IT, and Information & Broadcasting Ashwini Vaishnaw,
positioning Odisha as a future hub for one of the world’s most sophisticated
chip packaging technologies.
Addressing
the gathering, Majhi described the project as a historic milestone for both
Odisha and the nation. He said that for the first time in India, an advanced 3D
Glass Solutions semiconductor unit is being established, bringing immense pride
to the state. He noted that global technology leaders such as Intel, Lockheed
Martin, and Applied Materials are associated with cutting-edge packaging
technologies, and their interest signals Odisha’s growing industrial strength.
The
Chief Minister emphasised that products manufactured at the facility will cater
to next-generation sectors such as Artificial Intelligence, high-performance
computing, defence electronics, telecommunications, and advanced digital
systems. “Odisha is ready to play a pivotal role in realising Prime Minister
Narendra Modi’s vision of a self-reliant India in semiconductor and electronics
manufacturing,” he said.
Highlighting
the scale of the project, Majhi said the company is investing nearly ₹2,000 crore, with the facility expected to
produce 70,000 glass panels annually, along with 50
million assembled units and around 13,000 advanced 3D heterogeneous integration
modules. He added that Odisha has become the only state in the country to host
both India’s first compound semiconductor fabrication unit and its first 3D
glass substrate packaging facility.
The
Chief Minister further noted that the growing semiconductor ecosystem would
generate significant employment opportunities for engineering graduates,
diploma holders, and ITI students, helping transform Odisha into a
technology-driven growth hub.
Congratulating
the people of the state, Union Minister Ashwini Vaishnaw said that under the
leadership of Prime Minister Narendra Modi, India’s semiconductor sector is
witnessing rapid expansion, with Odisha emerging as a key contributor. He
observed that the state, traditionally known for minerals and metals, is
steadily establishing itself in advanced sectors such as electronics, IT, and
semiconductors.
Describing
the project as one of the most advanced manufacturing initiatives of its kind,
Vaishnaw said it would significantly strengthen India’s semiconductor value
chain. He highlighted that India’s electronics manufacturing has grown six-fold
over the past 12 years, with the country now emerging as the world’s
second-largest mobile phone manufacturer and a leading exporter in 2025.
He
further informed that two semiconductor projects have already been approved for
Odisha under the India Semiconductor Mission, while three more proposals are in
the pipeline. “Discussions are also underway with major global players,
including Intel, for future investments in the state,” he added.
On
railway infrastructure, Vaishnaw said projects worth over ₹90,000 crore are currently underway in Odisha,
with a record allocation of ₹10,928
crore. He noted that 59 stations are being redeveloped under the Amrit Bharat
Station Scheme and that all 30 districts are being brought under rail
connectivity, alongside key initiatives like the proposed four-line coastal
corridor from Balasore to Berhampur.
State
Electronics & IT Minister Dr. Mukesh Mahaling said Odisha is rapidly
emerging as a semiconductor hub, backed by progressive policies in IT, AI, and
semiconductor sectors. He highlighted initiatives aimed at skill development,
including stipend support for engineering students to build an industry-ready
workforce.
The
project is being implemented by 3D Glass Solutions Inc., USA, through its
wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions
Pvt. Ltd. at Info Valley in Khordha district. It is a greenfield, vertically
integrated advanced packaging and embedded glass substrate ATMP facility.
With a total investment of ₹1,943.53 crore — including ₹799 crore in Central support and around ₹399.5 crore from the State — the facility will cater to high-growth sectors such as data centres, AI, machine learning, 5G/6G communications, automotive radar, defence, aerospace, and photonics. Commercial production is expected to commence by August 2028, with full-scale operations targeted by August 2030.
The event was attended by senior officials including S. Krishnan, Secretary, Ministry of Electronics & IT, Odisha Chief Secretary Anu Garg, Additional Chief Secretary (Idustries) Hemant Sharma, Additional Chief Secretary (Electronics & IT Department) Vishal Kumar Dev, 3D Glass Solutions Chairman & CEO Babu Mandava, and other top bureaucrats and industry leaders.
